ترانزیستور ۲ان۳۹۰۶

Photomicrograph of the transistor "chip" inside a 2N3906 transistor package, showing the conductive metal layers used to connect the semiconductor junctions to the package leads. The upper-left and lower-right quadrants are bonding pad areas where wires for two of the terminals will attach, and the other two quadrants have the actual transistor structures, in a bulk region that is contacted at the back side of the chip to the third terminal.